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Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)
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a) Fabricaton steps. SiO 2 is used as a hard mask for etching LN. Cr... | Download Scientific Diagram
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Figure 5 from Aluminum oxide hard mask fabrication by focused ion beam implantation and wet etching | Semantic Scholar
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Integrated process feasibility of hard-mask for tight pitch interconnects fabrication (MEMS and Nanotechnology)
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